Mobile Phone PCBA board
Products feature
● -HDI / Any-laach / mSAP
● -Fine line en multilayer produksje kapasiteit
● -Avansearre SMT en nei gearkomste apparatuer
● -Exquisite ambacht
● -Isolearre funksje test kapasiteit
● -Low ferlies materiaal
● -5G Antenne Experience
Us tsjinst
● Us tsjinsten: One-stop PCB en PCBA elektroanyske manufacturing tsjinsten
● PCB manufacturing tsjinst: Need Gerber triem (CAM350 RS274X), PCB triemmen (Protel 99, AD, Eagle), etc
● Components sourcing tsjinsten: BOM list opnommen detaillearre Part number en Designator
● PCB assembly tsjinsten: De boppesteande triemmen en Pick en Place triemmen, assembly tekening
● Tsjinsten foar programmearring en testen: Programma, ynstruksje en testmetoade ensfh.
● Húsfesting tsjinsten: 3D triemmen, stap of oaren
● Reverse engineering tsjinsten: Samples en oaren
● Kabel & wire assembly tsjinsten: Spesifikaasje & oaren
● Oare tsjinsten: Wearde-tafoege tsjinsten
PCB Techinecal Kapasiteit
| Lagen | Mass produksje: 2 ~ 58 lagen / Pilot run: 64 lagen |
| Max.Dikte | Mass produksje: 394mil (10mm) / Pilot run: 17.5mm |
| Materiaal | FR-4 (Standert FR4, Mid-Tg FR4, Hi-Tg FR4, Leadfrij assemblagemateriaal), halogenfrij, keramysk gevuld, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, ensfh. |
| Min.Breedte / Spaasje | Binnenste laach: 3mil/3mil (HOZ), bûtenste laach: 4mil/4mil (1OZ) |
| Max.Koper dikte | UL sertifisearre: 6,0 OZ / Pilot run: 12OZ |
| Min.Hole Grutte | Mechanyske drill: 8mil (0.2mm) Laser drill: 3mil (0.075mm) |
| Max.Panel Grutte | 1150 mm × 560 mm |
| Aspect Ratio | 18:1 |
| Oerflakte ôfwurking | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| Spesjaal proses | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybride, Partial hybrid, Partial high density, Back drilling, and Resistance control |
